TY  - JOUR
A1  - Dong, H 
A1  - Li, Y 
A1  - Yim, M J
A1  - Moon, K S
A1  - Wong, C P
T1  - Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules.
Y1  - 2007/02/26
N1  - R831489
JF  - APPLIED PHYSICS LETTERS
J1  - APPL PHYS LETT
VL  - 90
IS  - 9
SP  - 092102 (3 pp.)
ER  - 


TY  - JOUR
A1  - Jiang, H 
A1  - Moon, K 
A1  - Li, Y 
A1  - Wong, C P
T1  - Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites.
Y1  - 2006/06/27
N1  - R831489
JF  - CHEMISTRY OF MATERIALS
J1  - CHEM MATER
VL  - 18
IS  - 13
SP  - 2969
EP  - 2973
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Xiao, F 
A1  - Moon, K 
A1  - Wong, C P
T1  - Novel curing agent for lead-free electronics: amino acid.
Y1  - 2005/01/15
N1  - R831489
JF  - JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY
J1  - J POLYM SCI POL CHEM
VL  - 44
IS  - 2
SP  - 1020
EP  - 1027
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Whitman, A 
A1  - Wong, C P
T1  - Enhancement of electrical properties of electrically conductive adhesives (ECAs) by using novel aldehydes.
Y1  - 2006/12/
N1  - R831489
JF  - IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
J1  - IEEE T COMPON PACK T
VL  - 29
IS  - 4
SP  - 758
EP  - 763
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering.
Y1  - 2006/02/
N1  - R831489
JF  - JOURNAL OF APPLIED POLYMER SCIENCE
J1  - J APPL POLYM SCI
VL  - 99
IS  - 4
SP  - 1665
EP  - 1673
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Wong, C P
T1  - Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications.
Y1  - 2006/01/30
N1  - R831489
JF  - MATERIALS SCIENCE AND ENGINEERING: R: REPORTS
J1  - NONE
VL  - 51
IS  - 1-3
SP  - 1
EP  - 35
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Moon, K 
A1  - Wong, C P
T1  - Electrical property improvement of electrically conductive adhesives through <em>in-situ</em> replacement by short-chain difunctional acids.
Y1  - 2006/03/
N1  - R831489
JF  - IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
J1  - IEEE T COMPON PACK T
VL  - 29
IS  - 1
SP  - 173
EP  - 178
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Wong, C P
T1  - Monolayer protection for eletrochemical migration control in silver nanocomposite.
Y1  - 2006/09/12
N1  - R831489
JF  - APPLIED PHYSICS LETTERS
J1  - APPL PHYS LETT
VL  - 89
IS  - 11
SP  - 112112
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Wong, C P
T1  - High performance anisotropic conductive adhesives for lead-free interconnects.
Y1  - 2006//
N1  - R831489
JF  - SOLDERING &AMP; SURFACE MOUNT TECHNOLOGY
VL  - 18
IS  - 2
SP  - 33
EP  - 39
ER  - 


TY  - JOUR
A1  - Li, Y 
A1  - Xiao, F 
A1  - Wong, C P
T1  - Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: tryptophan-cured diglycidyl ether of bisphenol A epoxy.
Y1  - 2007/01/15
N1  - R831489
JF  - JOURNAL OF POLYMER SCIENCE PART A: POLYMER CHEMISTRY
VL  - 45
IS  - 2
SP  - 181
EP  - 190
ER  -